Techniques for Suspect/Counterfeit EEE Parts Detection by X-Ray Photoelectron Spectroscopy (XPS) Test Method AS6171/20

This document defines capabilities and limitations of XPS as they pertain to Suspect/Counterfeit EEE part detection. Additionally, this document outlines requirements associated with the application of XPS, including training of instrument users, sample preparation, data interpretation, calibration, and reporting of test results. The Test Laboratory shall be accredited to ISO/IEC 17025 to perform one or more of the XPS Test Methods as defined in this standard. The Test Laboratory shall indicate in the ISO/IEC 17025 scope statement that they are accredited to XPS Spectral Analysis. In addition, the ISO/IEC 17025 scope statement shall indicate if the Test Laboratory is accredited to any of the following XPS Test Methods: XPS Imaging; XPS Depth Profiling; Angle Resolved XPS. This document contains Test Methods that can be specified by the Requester in generating the test requirements as part of the Statement of Work (SOW) or Purchase Order (PO) and can be used for Counterfeit Defect Coverage (CDC) calculations per AS6171/1. The following is a list of applicable Test Methods described in this document that are listed in 3.4 of AS6171 General Requirements: XPS - Spectral Analysis XPS - Spectral Analysis plus Imaging XPS - Spectral Analysis plus Depth Profiling XPS - Spectral Analysis plus Angle Resolved XPS. These Test Methods can be applied to either Active Parts or Passive Parts. XPS Spectral Analysis includes survey and, where applicable, high-resolution XPS and quantification. See Section 6 for a description of these procedures. If SAE AS6171/20 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.