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Test Methods Standard; General Requirements, Suspect/Counterfeit, Electrical, Electronic, and Electromechanical Parts

2019-03-26
WIP
AS6171B
This SAE Aerospace Standard (AS) standardizes inspection and test procedures, workmanship criteria, and minimum training and certification requirements to detect Suspect/Counterfeit (SC) Electrical, Electronic, and Electromechanical (EEE) parts. The requirements of this document apply once a decision is made to use parts with unknown chain of custody that do not have pedigree back to the original component manufacturer or have been acquired from a broker or independent distributor, or when there are other known risk elements that result in the User/Requester to have concerns about potential SC EEE parts. The tests specified by this standard may also detect occurrences of malicious tampering, although the current version of this standard is not designed specifically for this purpose. This standard ensures consistency across the supply chain for test techniques and requirements based on assessed risk associated with the application, component, supplier, and other relevant risk factors.
Standard

Techniques for Suspect/Counterfeit EEE Parts Detection by Design Recovery Test Methods

2018-08-24
WIP
AS6171/11A
This method outlines the requirements, capabilities, and limitations associated with the application of Design Recovery for the detection of counterfeit electronic parts including: Operator training; Sample preparation; Imaging techniques; Data interpretation; Design/functional matching; Equipment maintenance and; Reporting of data. The method is primarily aimed at analyses performed by circuit delayering and imaging with a scanning electron microscope or optical microscope; however, many of the concepts are applicable to other microscope and probing techniques to recover design data. The method is not intended for the purpose of manufacturing copies of a device, but rather to compare images or recover the design for determination of authenticity. If AS6171/11 is invoked in the contract, the base document, AS6171 General Requirements shall also apply. SAE Counterfeit Defect Coverage Tool
Standard

Requirements for Accreditation Bodies when Accrediting Test Laboratories Performing Detection of Suspect/Counterfeit in Accordance with AS6171 General Requirements and the Associated Test Methods

2018-05-16
CURRENT
AS6810
The criteria defined herein shall be utilized by an ISO/IEC 17025 Accreditation Body (AB) to establish conformance with AS6171 Test Methods Standard; General Requirements, Suspect/Counterfeit, Electrical, Electronic, and Electromechanical Parts and associated AS6171 Test Methods requested/included on the scope of accreditation.
Standard

Test Methods Standard; General Requirements, Suspect/Counterfeit, Electrical, Electronic, and Electromechanical Parts

2018-04-18
CURRENT
AS6171A
This SAE Aerospace Standard (AS) standardizes inspection and test procedures, workmanship criteria, and minimum training and certification requirements to detect Suspect/Counterfeit (SC) Electrical, Electronic, and Electromechanical (EEE) parts. The requirements of this document apply once a decision is made to use parts with unknown chain of custody that do not have pedigree back to the original component manufacturer or have been acquired from a broker or independent distributor, or when there are other known risk elements that result in the User/Requester to have concerns about potential SC EEE parts. The tests specified by this standard may also detect occurrences of malicious tampering, although the current version of this standard is not designed specifically for this purpose. This standard ensures consistency across the supply chain for test techniques and requirements based on assessed risk associated with the application, component, supplier, and other relevant risk factors.
Standard

Techniques for Suspect/Counterfeit EEE Assembly Detection by Various Test Methods

2017-09-22
WIP
AS6171/23
The intent of this test method is to describe high level processes to detect suspect/counterfeit (SC) Electrical, Electronic, and Electromechanical (EEE) Assemblies, covering both custom and military/commercial off-the-shelf (COTS) assemblies. This standard includes requirements for accreditation and certification of Laboratory and Laboratory personnel, and also, data collection, interpretation, and reporting as applicable to this test method. This standard covers EEE assemblies and includes electronic circuit card assemblies as defined under the definition for EEE Assembly and Electronic Circuit Card Assembly.
Standard

Techniques for Suspect/Counterfeit EEE Parts Detection by Acoustic Microscopy (AM) Test Methods

2017-09-11
WIP
AS6171/6A
Through the use of ultra-high frequency ultrasound, typically above 10 MHz, Acoustic Microscopy (AM) non-destructively finds and characterizes physical features and latent defects (visualization of interior features in a layer by layer process) - such as material continuity and discontinuities, sub-surface flaws, cracks, voids, delaminations and porosity. AM observed features and defects can be indicators that the components were improperly handled, stored, altered or previously used. If AS6171/6 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.
Standard

Technique for Suspect/Counterfeit EEE Parts Detection by Scanning Electron Microscopy (SEM) including Energy Dispersive X-Ray Spectroscopy Test Methods

2017-06-13
WIP
AS6171/22
To define capabilities and limitations of SEM-EDS as it pertains to counterfeit detection of EEE parts and suggest possible applications to these ends. Additionally, this document outlines requirements associated with the application of SEM-EDS including: Operator training; Sample preparation; Data interpretation; Equipment maintenance; and Reporting of data. If SAE AS6171/22 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.
Standard

Techniques for Suspect/Counterfeit EEE Parts Detection by External Visual Inspection, Remarking and Resurfacing, and Surface Texture Analysis Using SEM Test Methods

2017-05-11
CURRENT
AS6171/2A
This document describes the requirements of the following test methods for counterfeit detection of electronic components: a Method A: General EVI, Sample Selection, and Handling b Method B: Detailed EVI, including Part Weight measurement c Method C: Testing for Remarking d Method D: Testing for Resurfacing e Method E: Part Dimensions measurement f Method F: Surface Texture Analysis using SEM The scope of this document is focused on leaded electronic components, microcircuits, multi-chip modules (MCMs), and hybrids. Other EEE components may require evaluations not specified in this procedure. Where applicable this document can be used as a guide. Additional inspections or criteria would need to be developed and documented to thoroughly evaluate these additional part types. If AS6171/2 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.
Standard

Techniques for Suspect/Counterfeit EEE Parts Detection by Delid/Decapsulation Physical Analysis Test Methods

2017-02-01
WIP
AS6171/4A
This method standardizes inspection, test procedures and minimum training and certification requirements to detect Suspect/Counterfeit (SC) Electrical, Electronic, and Electromechanical (EEE) components or parts utilizing Delid/Decapsulation Physical Analysis. The methods described in this document are employed to either delid or remove the cover from a hermetically sealed package or to remove the encapsulation or coating of an EEE part, in order to examine the internal structure and to determine if the part is suspect counterfeit. Information obtained from this inspection and analysis may be used to: a. prevent inclusion of counterfeit parts in the assembly b. identify defective parts c. aid in disposition of parts that exhibit anomalies This test method should not be confused with Destructive Physical Analysis as defined in MIL-STD-1580. MIL-STD-1580 describes destructive physical analysis procedures for inspection and interpretation of quality issues.
Standard

Techniques for Suspect/Counterfeit EEE Parts Detection by Thermomechanical Analysis (TMA) Test Methods

2016-12-09
WIP
AS6171/18
This test method provides the capabilities, limitations, and suggested possible applications of TMA as it pertains to detection of suspect/counterfeit EEE parts. Additionally, this document outlines requirements associated with the application of TMA including: equipment requirements, test sample requirements, methodology, control and calibration, data analysis, reporting, and qualification and certification.
Standard

Techniques for Suspect/Counterfeit EEE Parts Detection by Auger Electron Spectroscopy (AES) Test Method

2016-12-09
WIP
AS6171/19
This document defines capabilities and limitations of Auger Electron Spectroscopy (AES) as it pertains to detection of suspect/counterfeit EEE parts and suggests possible applications to these ends. Additionally, this document outlines requirements associated with the application of AES including: operator training and requirements; sample preparation; data interpretation and reporting of data.
Standard

Techniques for Suspect/Counterfeit EEE Parts Detection by Gas Chromatography/Mass Spectrometry (GC/MS) Test Methods

2016-12-09
WIP
AS6171/21
This document defines capabilities and limitations of Gas Chromatography/Mass Spectrometry (GC/MS) as it pertains to detection of suspect/counterfeit EEE parts and suggests possible applications to these ends. Additionally, this document outlines requirements associated with the application of GC/MS including: operator training; sample preparation; various sampling techniques; data interpretation; computerized spectral matching; equipment maintenance; and reporting of data. The discussion is limited to unit mass resolution spectrometers such as quadrupole systems and electron impact ionization.
Standard

Techniques for Suspect/Counterfeit EEE Parts Detection by X-Ray Photoelectron Spectroscopy (XPS) Test Method

2016-12-09
WIP
AS6171/20
To define capabilities and limitations of X-Ray Photoelectron Spectroscopy (XPS) as it pertains to detection of suspect/counterfeit EEE parts and suggest possible applications to these ends. Additionally, this document outlines requirements associated with the application of XPS including: operator training and requirements; sample preparation; data interpretation; and data reporting procedures.
Standard

Suspect/Counterfeit Test Evaluation Method

2016-10-30
CURRENT
AS6171/1
This document describes an assessment of the effectiveness of a specified test plan used to screen for counterfeit parts. The assessment includes the determination of the types of defects detected using a specified test plan along with the related counterfeit type coverage. The output of this evaluation will produce Counterfeit Defect Coverage (CDC), Counterfeit Type Coverage (CTC), Not-Covered Defects (NCDs), and Under-Covered Defects (UCDs). This information will be supplied to the test laboratory’s customer in both the test report and the Certificate of Quality Conformance (CoQC). This evaluation method does not address the effectiveness of detecting tampered type devices. The Test Evaluation Method also describes an Optimized Test Sequence Selection, in which a test sequence is selected that maximizes the CDC utilizing test cost and time as constraints, for any tier level except the Critical Risk Level. The constraints can be adjusted until the desired CDC is achieved.
Standard

Techniques for Suspect/Counterfeit EEE Parts Detection by Design Recovery Test Methods

2016-10-30
CURRENT
AS6171/11
This method outlines the requirements, capabilities, and limitations associated with the application of Design Recovery for the detection of counterfeit electronic parts including: Operator training; Sample preparation; Imaging techniques; Data interpretation; Design/functional matching; Equipment maintenance and; Reporting of data. The method is primarily aimed at analyses performed by circuit delayering and imaging with a scanning electron microscope or optical microscope; however, many of the concepts are applicable to other microscope and probing techniques to recover design data. The method is not intended for the purpose of manufacturing copies of a device, but rather to compare images or recover the design for determination of authenticity. If AS6171/11 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.
Standard

Techniques for Suspect/Counterfeit EEE Parts Detection by Radiological Test Methods

2016-10-30
CURRENT
AS6171/5
The intent of this document is to define the methodology for suspect parts inspection using radiological inspection. The purpose of radiology for suspect counterfeit part inspection is to detect deliberate misrepresentation of a part, either at the part distributor or original equipment manufacturer (OEM) level. Radiological inspection can also potentially detect unintentional damage to the part resulting from improper removal of part from assemblies, which may include, but not limited to, prolonged elevated temperature exposure during desoldering operations or mechanical stresses during removal. Radiological inspection of electronics includes film radiography and filmless radiography such as digital radiography (DR), real time radiography (RTR), and computed tomography (CT). Radiology is an important tool used in part verification of microelectronic devices.
Standard

Techniques for Suspect/Counterfeit EEE Parts Detection by Delid/Decapsulation Physical Analysis Test Methods

2016-10-30
CURRENT
AS6171/4
This method standardizes inspection, test procedures and minimum training and certification requirements to detect Suspect/Counterfeit (SC) Electrical, Electronic, and Electromechanical (EEE) components or parts utilizing Delid/Decapsulation Physical Analysis. The methods described in this document are employed to either delid or remove the cover from a hermetically sealed package or to remove the encapsulation or coating of an EEE part, in order to examine the internal structure and to determine if the part is suspect counterfeit. Information obtained from this inspection and analysis may be used to: a prevent inclusion of counterfeit parts in the assembly b identify defective parts c aid in disposition of parts that exhibit anomalies This test method should not be confused with Destructive Physical Analysis as defined in MIL-STD-1580. MIL-STD-1580 describes destructive physical analysis procedures for inspection and interpretation of quality issues.
Standard

Techniques for Suspect/Counterfeit EEE Parts Detection by Acoustic Microscopy (AM) Test Methods

2016-10-30
CURRENT
AS6171/6
Through the use of ultra-high frequency ultrasound, typically above 10 MHz, Acoustic Microscopy (AM) non-destructively finds and characterizes physical features and latent defects (visualization of interior features in a layer by layer process) - such as material continuity and discontinuities, sub-surface flaws, cracks, voids, delaminations and porosity. AM observed features and defects can be indicators that the components were improperly handled, stored, altered or previously used. If AS6171/6 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.
Standard

Techniques for Suspect/Counterfeit EEE Parts Detection by X-ray Fluorescence Test Methods

2016-10-30
CURRENT
AS6171/3
XRF technique for counterfeit detection is applicable to electrical, electronic and electromechanical (EEE) parts as listed in AS6171 General Requirements. In general, the detection technique is meant for use on piece parts prior to assembly on a circuit board or on the parts that are removed from a circuit board. The applicability spans a large swath of active, passive and electromechanical parts. If AS6171/3 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.
Standard

Techniques for Suspect/Counterfeit EEE Parts Detection by Thermogravimetric Analysis (TGA) Test Methods

2016-10-30
CURRENT
AS6171/10
This test method provides the capabilities, limitations, and suggested possible applications of TGA as it pertains to the detection of counterfeit electronic components. Additionally, this document outlines requirements associated with the application of TGA including: equipment requirements, test sample requirements, methodology, control and calibration, data analysis, reporting, and qualification and certification. If AS6171/10 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.
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