TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY RADIATED ELECTROMAGNETIC EMISSION (REME) ANALYSIS TEST METHODS AS6171/14

The intent of this document is to define the methodology for suspect/counterfeit parts inspection using REME Analysis. The purpose of REME Analysis for suspect counterfeit part inspection is to detect misrepresentation or tampering of a part. REME Analysis can also potentially detect unintentional damage to the part resulting from improper removal of the part from assemblies, exposure to electrostatic discharge, exposure to radiation outside of acceptable limits (ionizing or high-power electromagnetic), or degradation. Improper removal of part from assemblies may include, but is not limited to, prolonged elevated temperature exposure during desoldering operations or mechanical stresses during removal. Degradation may include, but is not limited to, prolonged burn-in/testing, exposure to out-of-specification environmental conditions, or use outside of expected electrical tolerances. REME Analysis may be able to detect the differences between devices that were manufactured in different fabrication facilities or during different fabrication runs; this would be useful to detect clones. REME Analysis may also be able to identify parts that have not completed the authorized manufacturing and test process. REME Analysis includes spectrographic analysis, time-frequency analysis, and electromagnetic emission radiation response analysis to input signal variations. REME Analysis is performed on parts to verify that the sub- and super- threshold radiated emissions are consistent with a known exemplar item or a set of anticipated parameters based on a distribution of exemplar items. In case an exemplar item is not available, comparisons should be made within an expected homogenous sample population using the technical data available for that item.