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The questions of the gas filled heat pipes' application for thermal control systems of scientific equipment are discussed. It is analyzed different extents of electronic components' integration: creating of thermal stability mounting places of devices; creating of cooled planes and surfaces on device's body; providing of thermal stability of internal components. It is proposed design decisions providing of compensation some variable parameters such as device heat flows, external heat influences that are typical for near-earth orbits. Tests' results have shown the principal ability to construct schemes for thermal control of electronic components.