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The development of an automotive qualified packaging technology for CMOS and CCD imager chips is described. A flip-chip-on-flex solution was developed. This package solution was demonstrated using a 1/3 inch optical format imager chip that was designed for use with conventional ceramic leadless chip carrier packaging. Overall package thickness is 1.39mm, with the complete back-side of the silicon substrate exposed and available for chip cooling. The flex is bonded to a glass substrate, which provides the optical access to the imager chip. The use of a transparent underfill material reduces the rate of moisture infiltration and reduces optical reflections within the package structure. The flex may be extended beyond the package to allow surface mounting of additional passive and active components, as well as interconnection to additional circuitry.

The industry strategy for automotive safety systems has been evolving over the last 20 years. Initially, individual passive devices and features such as seatbelts, airbags, knee bolsters, crush zones, etc. were developed for saving lives and minimizing injuries when an accident occurs. Later, preventive measures such as improving visibility, headlights, windshield wipers, tire traction, etc. were deployed to reduce the probability of getting into an accident. Now we are at the stage of actively avoiding accidents as well as providing maximum protection to the vehicle occupants and even pedestrians. Systems that are on the threshold of being deployed or under intense development include collision detection / warning / intervention systems, lane departure warning, drowsy driver detection, and advanced safety interiors.