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Structural and thermal engineers currently work independently of each other using unrelated tools, models, and methods. Without the ability to rapidly exchange design data and predicted performance, the achievement of the ideals of concurrent engineering is not possible. Thermal codes have been unable to exploit the geometric information in structural models and the CAD design database, and do not facilitate transfer of temperature data to other discipline’s analysis models. This paper discusses the key features in Thermal Desktop for supporting integrated thermal/structural analysis. Approaches to thermal modeling in an integrated analysis environment are discussed along with Thermal Desktop’s data mapping algorithm for exporting temperature data on to structural model grid points.

Thermal analysis is typically executed with multiple tools in a series of separate steps for performing radiation analysis, generating conduction and capacitance data, and for solving temperatures. This multitude of programs often leads to many user files that become unmanageable with their multitude, and the user often looses track as to which files go with which cases. In addition to combining the output from multiple programs, current processes often involve the user inputting various hand calculations into the math model to account for MLI/Insulation and contact conductance between entities. These calculations are not only tedious to make, but users often forget to update them when the geometry is changed. Several new features of Thermal Desktop are designed to automate some of the tedious tasks that thermal engineers now practice.

Thermal engineering has long been left out of the concurrent engineering environment dominated by CAD (computer aided design) and FEM (finite element method) software. Current tools attempt to force the thermal design process into an environment primarily created to support structural analysis, which results in inappropriate thermal models. As a result, many thermal engineers either build models “by hand” or use geometric user interfaces that are separate from and have little useful connection, if any, to CAD and FEM systems. This paper describes the development of a new thermal design environment called the Thermal Desktop. This system, while fully integrated into a neutral, low cost CAD system, and which utilitizes both FEM and FD methods, does not compromise the needs of the thermal engineer.

RadCAD™1 is a PC based radiation analyzer program that combines a modern graphics based user interface, advanced computational algorithms, and sophisticated CAD techniques into a single integrated environment. This paper presents RadCAD's development status and describes newly implemented features.

In order to meet the challenging thermal analysis needs of Space Station Freedom and other proposed Space Exploration Initiative missions, a new generation of thermal analysis tools, utilizing the latest advances in user-interface design, software engineering approaches, graphics capability, CPU speed, and networking technology will be needed. NASA Johnson Space Center has commissioned the development of the Thermal Synthesizer System (TSS) to meet these difficult analysis requirements. TSS is being developed by Lockheed Missiles and Space Company, Lockheed Engineering Sciences Company, and NASA Johnson Space Center. The system consists of integrated applications to perform: surface and solid modeling, radiation coupling, orbital analysis, characterization of the thermal radiation heating environment for a spacecraft in orbit or on a planet surface, conduction network generation, two-phase flow modeling and analysis, temperature predictions, and general purpose post-processing.