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Standard

ELECTROMAGNETIC COMPATIBILITY MEASUREMENT PROCEDURES FOR INTEGRATED CIRCUITS—INTEGRATED CIRCUIT RADIATED EMISSIONS DIAGNOSTIC PROCEDURE 1 MHZ TO 1000 MHZ, MAGNETIC FIELD—LOOP PROBE

1995-03-01
HISTORICAL
J1752/2_199503
This SAE Recommended Practice defines a method for evaluating the near field magnetic component of the electromagnetic radiation from an integrated circuit. The method uses a shielded, single turn loop as a probe to measure magnetic emissions from 1 to 1000 MHz at a controlled distance and orientation from an integrated circuit. The method primarily measures the magnetic field generated by IC current loops perpendicular to the IC surface in the lead frame. This document is applicable to measurements from an individual IC mounted on a standardized test board or in-situ on a circuit board. Comparisons using the IC emissions reference levels require using identical circuit boards or the standardized IC test board.
Standard

ELECTROMAGNETIC COMPATIBILITY MEASUREMENT PROCEDURES FOR INTEGRATED CIRCUITS—INTEGRATED CIRCUIT RADIATED EMISSIONS MEASUREMENT PROCEDURE 150 KHZ TO 1000 MHZ, TEM CELL

1995-03-01
HISTORICAL
J1752/3_199503
This SAE Recommended Practice defines a method for measuring the electromagnetic radiation from an integrated circuit. The method uses a standardized IC test board containing the IC being evaluated mounted to a mating port cut in the top or bottom of a 1 GHz TEM cell. The standardized test board controls the geometry and orientation of the operating IC relative to the TEM cell and eliminates any connecting leads within the cell (these are on the back side of the board which is outside the cell). One of the TEM cell feeds is terminated with a 50 Ω load and the other one is connected to the input of a spectrum analyzer which measures the RF emissions over the frequency range of 150 kHz to 1000 MHz emanating from the integrated circuit and impressed onto the septum of the TEM cell (see Figure 1).
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