Risk Assessment after Tin Whiskers are Observed
Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder
Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts
Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder and Finishes
Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder
This standard defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electronic systems containing Pb-free solder, piece parts, and PBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance.
It is intended to communicate requirements for a Pb-free Control Plan (LFCP), hereinafter referred to as the Plan, and to assist the Plan Owners in the development of their own Plans. The Plan documents the Plan Owner’s processes that assure their customers, and all other stakeholders that the Plan Owner's products will continue to meet their requirements, given the risks stated in the Introduction.