Integration of Simulation and Testing for Microelectronics Package Reliability Improvement 980345
Computer simulation has been used as a vital and powerful tool for evaluating stresses in microelectronics packages due to thermal-mechanical loading. Experimental measurement and reliability testing have been performed for modeling correlation and verification. In the past several years, the authors have been integrating computer simulation and testing to significantly improve package reliability at Motorola SPS. Several examples are presented for illustration and demonstration of the methodology.
Citation: Li, Q., Dougherty, D., and Xu, Y., "Integration of Simulation and Testing for Microelectronics Package Reliability Improvement," SAE Technical Paper 980345, 1998, https://doi.org/10.4271/980345. Download Citation
Author(s):
Quan Li, David Dougherty, Yong Li Xu
Affiliated:
Semiconductor Products Sector (SPS), Motorola Inc.
Pages: 13
Event:
International Congress & Exposition
ISSN:
0148-7191
e-ISSN:
2688-3627
Also in:
Automotive Electronics Reliability-PT-82, Automotive Microcontrollers-PT-75, Electronic Packaging-SP-1345
Related Topics:
Computer simulation
Reliability
Simulation and modeling
Logistics
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