High Conductance Thermal Interface Concept for Space Applications 911340
An interface concept has been developed which produces high conductance at a thermal/mechanical joint without resorting to high clamping forces or potentially contaminating fillers such as thermal grease. This paper discusses the characteristics of several variations of the high conductance interface concept and compares them to those of existing interface concepts proposed for several Space Station applications. The application of the high conductance concept to thermal joints such as internal coldplate interfaces and external equipment module to heat acquisition plate interfaces would reduce the weight and complexity and increase the efficiency of the Space Station Thermal Management System.
Citation: Poulin, E. and Horan, D., "High Conductance Thermal Interface Concept for Space Applications," SAE Technical Paper 911340, 1991, https://doi.org/10.4271/911340. Download Citation
Author(s):
Elizabeth C. Poulin, D. Clay Horan
Pages: 11
Event:
International Conference On Environmental Systems
ISSN:
0148-7191
e-ISSN:
2688-3627
Also in:
Space Station Eclss and Thermal Control-SP-0875
Related Topics:
Spacecraft
Thermal management
Conductivity
Lubricating greases
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