Laser marking has been used for some years now, particularly in the electronics industry where this was a natural outgrowth of laser resistor trimming.
Within the electronics business, there are a growing number of applications including the case of silicon wafer identification and in the general industrial world, laser marking has proved to be a cost effective competitor to stamping, chemical etching and other alternate techniques.
The principles of operation are discussed including selection of laser and optical systems. Some system features are discussed in more detail including the interaction between the laser beam and the material.
Reading systems are reviewed and system considerations necessary for automated products are discussed.
