Browse Publications Technical Papers 2006-01-0955
2006-04-03

Adhesive Modeling in Crash Simulation 2006-01-0955

A practical modeling methodology for adhesively bonded structures using discrete springs has been developed for crash simulation. As a first step, a series of coupon tests with adhesively bonded substrates have been conducted under tension, peel and shearing. Both deformable and rigid substrates have been used in these tests. The resulting data has been used to determine the properties of the adhesive springs. A set of numerical simulations of the coupon tests have been conducted to verify that the adhesive spring properties derived earlier do indeed represent the mechanical properties of the physical adhesives in the coupon tests.

SAE MOBILUS

Subscribers can view annotate, and download all of SAE's content. Learn More »

Access SAE MOBILUS »

Preview Document Add to Cart
Members save up to 16% off list price.
Login to see discount.
Special Offer: Download multiple Technical Papers each year? TechSelect is a cost-effective subscription option to select and download 12-100 full-text Technical Papers per year. Find more information here.
We also recommend:
TECHNICAL PAPER

Finite Element Modeling of Adhesive Joint Behavior for Automotive Applications

2006-01-0777

View Details

TECHNICAL PAPER

Structure-borne Vehicle Analysis using a Hybrid Finite Element Method

2009-01-2196

View Details

TECHNICAL PAPER

Designing Composite Vehicles Against Blast Attack

2007-01-0137

View Details

X