Packaging of MEMS: An Aerospace Perspective 2003-01-2891

After a long “incubation” period, MEMS are finally strongly coming out on the marked. The integrated telemetry and the photo-voltaic power source are among the attractive features of the integrated MEMS applications. The tendency is more and more seen to small integrators, which use OEMs and build systems for market demanded applications. However, the products offered by the market at this time are mostly limited to static detection or inertial systems. The temperature range of the dominant applications quite significantly limits the measurement capabilities of the system. Aerospace systems are not necessary falling within the normal temperature range. The need of enhanced performance and safety of the gas turbine engines require pressure measurements at temperature that exceed 500 °C. Apart from the physics, the principle of measurement, fabrication technology, signal data processing, packaging represents a challenging task. Other packaging challenges for fluidic or optical applications will be presented and a range of possible solutions will be presented.