Thin Film Pressure Sensor Technology Applied to Catalytic Converter Packaging 2001-01-0223
Application of new ultra-thinwall ceramic substrate technology to many new vehicle exhaust emission applications has lead to an interest in better understanding the pressures to which substrates are exposed during packaging operations. A recently identified thin film load cell technology has permitted a more analytical evaluation of pressure distributions that develop during ceramic substrate packaging. The optimum configuration of this technique for studying canning operations will be investigated as part of the study. In addition to identifying the characteristic pressure distributions created during canning processes, the impact of various process parameters on this distribution was also investigated.
