Thermal Conductivity Measurement on High Modulus Dielectric Materials Used in Insulated Metal Substrate 1999-01-0167
Insulated metal substrate (IMS) materials are becoming accepted in automotive power electronics assemblies. Power electronics surface mount technology assemblies use IMS materials to provide electrical isolation and thermal management. There are differences of opinion regarding the test method used to evaluate the thermal conductivity of the electrical isolation used in IMS's. Techniques have been developed to extend usefulness of test methods included in ASTM D 5470-95 to electrical isolation materials that are thin, have high glass transition temperature and high modulus.. The data generated meet the needs of finite element thermal analysis modeling.
Citation: Ng, L., Bui, M., Gundale, B., and Fick, H., "Thermal Conductivity Measurement on High Modulus Dielectric Materials Used in Insulated Metal Substrate," SAE Technical Paper 1999-01-0167, 1999, https://doi.org/10.4271/1999-01-0167. Download Citation
Author(s):
Li Voon Ng, Minh Bui, Benjamin P. Gundale, Herbert J. Fick
Affiliated:
The Bergquist Company
Pages: 6
Event:
International Congress & Exposition
ISSN:
0148-7191
e-ISSN:
2688-3627
Related Topics:
Insulation
Conductivity
Finite element analysis
Power electronics
Test procedures
Thermal management
Glass
Metals
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