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Technical Paper

A Small Outline Pressure Sensor for Automotive Applications

1999-03-01
1999-01-1036
A small outline pressure sensor has been developed for use in various automotive applications including vehicle dynamic control (VDC), gasoline direct fuel injection, common rail diesel fuel injection, and other emerging systems. This sensor uses a stainless steel diaphragm for fluid compatibility and can be built in versions to measure a wide range of pressures from 0-700 kPa (100 psi up to 0-180 MPa (26,000 psi). Advanced diagnostic and protection functions are included in the electronics to alert the electronic control module of possible sensor or system failures. All signal conditioning functions are integrated into a single CMOS integrated circuit to reduce cost, size, and complexity.
Technical Paper

High Pressure Sensor for Use in Common Rail Diesel Fuel Injection Systems

1998-02-01
980163
A high pressure sensor has been developed for use in common rail diesel fuel injection systems. This sensor uses a stainless steel diaphragm for fluid compatibility and operates at very high pressures (up to 26,000 psi or 180 MPa). Advanced diagnostic and protection functions are included in the electronics to alert the electronic control module of possible sensor failures. All signal conditioning functions are integrated into a single CMOS integrated circuit to reduce cost, size, and complexity. Diesel direct injection (DI) engines based on high pressure common rail fuel injection systems using these pressure sensors offer improved fuel efficiency, reduced emissions, and other benefits.
Technical Paper

New Accelerometer Based on Innovative Packaging and Circuit Design

1995-02-01
951018
A signal-conditioned accelerometer is described which offers many advantages to the user. The sensor element, manufactured using silicon micromachining, has proven reliability. The signal conditioning does not require external components and thick or thin film technology but is done entirely within a monolithic IC. The sensor and signal conditioning chips are hermetically packaged together in a ceramic leadless chip carrier. The output parameters are trimmed electrically after packaging is completed. The chip carrier can be mounted in several orientations to allow measurement of acceleration either perpendicular to or in plane with the mounting surface.
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