Search Results

A silicon micromachined gyroscope (angular rate sensor, yaw rate sensor) and accelerometer for vehicle stability control system is presented. The 5.1mm×4.7mm sensor chip is fabricated with a silicon micromachining process using a SOI (Silicon on Insulator) silicon wafer and a deep reactive ion etching. The sensor chip has a pair of resonators which are mechanically coupled and function as a tuning fork. The resonators are driven by electrostatic force and their movements are detected by capacitively sensing angstrom displacements. This sensor chip works not only as a gyroscope but also as an accelerometer with a single sensor chip. The sensor unit consists of the sensor chip above, a signal processing IC, a microcomputer and an EEPROM. sigma-delta analog-to-digital conversion (sigma-delta ADC) is adopted to realize the digital calibration of sensor properties.

With an ever growing demand for the enhanced control of a vehicle and for the reduction of power and signal distributing wires in a vehicle, there is a pressing need for the development of Local Area Network (LAN) in a vehicle. LAN enables the exchange of various data among several electronic control units (ECUs), and results in the higher controlled performances of a vehicle and the reduction of the wires. In response to this need, two integrated circuits for vehicle multiplexing communication are developed. One is a communication control IC and the other is a bus driver/receiver IC, both based upon the standard of a PWM type of the J1850 for a communication protocol. The communication control IC is designed to have distinctive features such as a highly fail-safe operation and the reduction of the overhead for communication imposed on a central processing unit (CPU) of the ECU.