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Technical Paper

Stress Isolation of an Accelerometer Die in a Post-molded Plastic Package - The Impact of Die Coat Coverage

1999-03-01
1999-01-0157
This study addresses the influence that die coat coverage in a medium g accelerometer post-molded plastic package has on the mechanical response of the substrate where the sensing element is anchored. It explains the importance of the isolation gap between the mold compound and the die coat and relates the gap existence to the thickness of the die coat. The analysis suggests a criterion for a minimum thickness of the die coat that should be utilized in manufacturing.
Technical Paper

A Monolithic Integrated Solution for MAP Applications

1997-02-24
970608
A monolithic sensing solution for manifold absolute pressure (MAP) is presented. This work includes examination of design, fabrication, temperature compensation, packaging and electromagnetic compatibility (EMC) testing of the fully integrated monolithic sensor. The circuit uses integrated bipolar electronics and conventional IC processing. The amplification circuit consists of three op-amps, seven laser trimmable resistors, and other active and passive components. Also discussed is a summary of an automotive application MAP sensor general specification, test methods, assembly, packaging, reliability and media testing for a single chip solution.
Technical Paper

An Integrated Silicon Bulk Micromachined Barometric Pressure Sensor for Engine Control Unit and External Mount

1997-02-24
970610
An Integrated Barometric Absolute Pressure Sensor (IBAP) solution for barometric pressure sensing is presented here. The IBAP is a silicon bulk micromachined monolithic pressure sensor. This work includes an examination of the design, fabrication, temperature compensation, and testing aspects. In addition, options and issues related to the mounting of the IBAP device will be presented. Two techniques, including surface mounting the sensor on the engine control unit (ECU) PWB are discussed.
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