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The approach of finite element method (FEM) for simulation of thermal state of space apparatus and heat pipes integrated is presented. The practical tool discussed is 2D finite software package “HEAT'90”. Questions dealing with modeling of 2D construction, accuracy of simplification of 3D objects to pseudo 3D are under consideration. Several practically used cases of heat pipes connections with surrounding are analyzed: heat pipes are installed onto surface of device, heat pipes are inset into honeycomb panels, heat pipe crossing. Samples of simulation of heat pipe network for honeycomb panels illustrate the range of possibilities to forecast the thermal state of complicated ramified systems by using non traditional numerical FEM analyzer.

The questions of the gas filled heat pipes' application for thermal control systems of scientific equipment are discussed. It is analyzed different extents of electronic components' integration: creating of thermal stability mounting places of devices; creating of cooled planes and surfaces on device's body; providing of thermal stability of internal components. It is proposed design decisions providing of compensation some variable parameters such as device heat flows, external heat influences that are typical for near-earth orbits. Tests' results have shown the principal ability to construct schemes for thermal control of electronic components.

An approach to the creation of passive radiative cooling system ensuring temperature levels less than 220K for the optical sensor of scientific space equipment elements is considered. The system is intended for the arbitrary orientation-in-space function under solar radiation. Theoretical analysis of the application field of this system, using heat pipes with constant and variable thermal resistance in a range of solar constant variation (500…2700)W/m2 is given. Experimental results on system models, in which two engaged in parallel thermodiodes with freon-22 and ammonium were used, showed the possibility to attain device temperature levels less than 220 K at the solar constant magnitude 1400 W/m2 and device heat release under (1…2) W.