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This paper presents a breakthrough in the domain of micro heat pipes for electronic cooling. The proposed technology consists of a novel, sophisticated but industrial approach in cooling technique with flat and ultra-thin microchannel heat pipes. We present in the introduction the current needs in term of cooling system for electronic applications. The particular case of space based system is discussed and few projections into the future demonstrate the need for a new generation of cooling device. The fabrication process is explained to present our product and its flexibility of design and capacity. The key features and performances of a prototype based on this new generation heat pipe are presented.