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In this work, the goal of enhanced reliability through redundancy is explored. Two levels of fusion have been defined: the first is a fusion of sensors, redundant in both number and type, and the second is a statistical fusion of the resulting data at a software level. An intermediate preprocessing level is required to connect both fusions. The various types of sensors which are included are bulk micromachined flow, pressure and hydrogen sensors and a thin film poly-crystalline silicon temperature sensor. Individual sensors have been fabricated and packaged in arrays. Associated preprocessing has been designed to be able to handle all of the signals coming from each sensor and prepare them for statistical analysis. Data fusion algorithms have been written and tested.

This paper provides several examples of silicon “micromachined” semiconductor sensors with which the authors are involved for aerospace condition monitoring. This and related work in MEMS (Micro Electro Mechanical Systems) has the potential to revolutionize condition monitoring in aerospace condition and “health monitoring” by (1) moving “smart” electronics out to the sensor chip itself and (2) combining a vast quantity and types of, not only electronic, but micromechanical sensing schemes into the silicon chip . Precisely formed cantilevers, gears, valves, microplumbing and even micro motors of the cross-section of a human hair can be fabricated on a single silicon microchip. Silicon is an excellent mechanical material with a yield strength several times that of stainless steel. Also silicon has excellent thermal properties , whereas compatible silicon dioxide (which we typically use in connection with silicon microelectronics patterning) is virtually a thermal insulator.