Technical Paper
Lead Free Solder for Automotive Electronics
1998-02-23
980098
Several lead-free alloys have been studied for potential use in electronics by the National Center for Manufacturing Sciences(NCMS) Lead Free Solder Consortium that ended in 1996. Since then, one of these alloys has been studied using an existing product in order to determine the viability of Lead Free Vehicle Electronics. Design, supply chain, manufacturability, and reliability data for the electronics components and system are a part of this paper.
