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The MPLM (Mini Pressurized Logistic Module) is one of the Elements constituting the ISSA (International Space Station Alpha). With respect to the other Elements, the MPLM is not permanently attached to the ISSA, but it is transported by the Orbiter several times from/to the Earth, since its primary use is to resupply and return cargos. The MPLM capability to support the logistic flights is guaranteed during several mission phases (ground, Orbiter transportation, on-orbit docked to the Station). Since the installed cargo can be passive or active, the required MPLM functions are based on the actual flight. This paper presents an overview of the activities performed in Alenia Spazio to identify the criticality and peculiarity of the MPLM mission scenarios from the thermal point of view. The best technical solutions, foreseen up to now, have been implemented in the design to guarantee the reliability requested by such an important and unique Space Station Element.

The Columbus Attached Pressurised Module (APM) Active Thermal Control System (ATCS) water loop collects the APM waste heat and transfers it to the Space Station Freedom (SSF) Central Thermal Bus (CTB). The interface between the APM water loop and the SSF ammonia loops is achieved with two ammonia/water interloop heat exchangers (IH/X), one being low temperature (LT) and the other moderate temperature (MT). The APM internal water loop provides cooling to payload and subsystem users which have varying temperature requirements at their heat rejection interfaces, and can be categorized as cold branch and warm branch users, (e.g. condensing heat exchanger (CHX) and refrigerator are cold branch users, while Avionic heat exchanger (AHX) and furnace payloads would be warm branch users.)

Thermal control design of Columbus pressurised modules has evolved throughout phases B and C0 of the program leading to the C/D proposal emission. Proposal comments by the European Space Agency (ESA), negotiation of interfaces between Space Station Freedom (SSF) partners, possible advantageous design commonalities among the attached pressurised modules and MTFF reconfiguration are ongoing activities. This paper discusses the design solutions presented in the thermal control subsystem C/D proposal including modifications deriving from updated ESA requirements and preliminary feedback from negotiation of interfaces.