Search Results

In the short term, traditional thermal control techniques, currently reaching their potential limit, will no longer meet the challenge imposed by the natural evolution in electronic packaging, characterized by an ever-increasing level of integration and power. In this context, new architectures must be developed, with thermal control based on high performance heat transfer devices. The Integration of Miniature Heat Pipe (MHP) seems to be one of the most effective and promising solutions for the future. This paper summarizes the work, performed within the frame of a partnership with the CNES, aiming at contributing to develop and evaluate this technology. Beyond theoretical and technological studies, we have manufactured or supplied several miniature heat pipe devices (MHPD) to constitute the elementary thermal control blocks, corresponding to the main packaging hierarchical levels (components, boards, equipment) of future generation of space vocation electronic units.