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Heat dissipated in conduction cooled spacecraft components must be transported across the component base plate/spacecraft mounting plate interface preparatory to final radiation to the space sink. Proper engineering requires that this be accomplished in readily predictable ways, with small temperature differentials, using reliable and practical hardware. This paper conducts a review of the subject and provides design guidance. Areas covered are background and general principles; conductance of bare interfaces (or joints) under uniform pressure; conductance of bare bolted joints; thermal/structural analysis; conductance of bolted joints with thermal enhancement fillers. In addition, the review deals with a variety of special mountings, such as honeycomb panels and thermal doublers, and with a number of bolt patterns.