Search Results

Increasingly, manufacturers are looking to computer simulation methods to accurately assess ride quality potential of new vehicle designs as they are being developed. This requires detailed multi-body dynamic models to be developed with sufficient fidelity to replicate ride relevant phenomenon. These models must have the capability to: Represent the distributed mass and elasticity of the vehicle structures (e.g. frame ladder, cab, and trailer). Include the non-linear behavior of shock absorbers and elastomeric components. Reproduce the fundamental system dynamics that influence ride. Provide output of the acceleration, velocity, and displacement measures needed to compute ride quality. This paper discusses the development of an ADAMS multi-body dynamic model of a tractor semi-trailer for use as a predictive tool in evaluating ride quality design improvements.

High density electronic packaging applications will benefit by utilizing this very thin multilayer interconnect construction. Specific advantages include higher packaging density, thinner composite profiles, and flexibility for installation. Especially useful for automotive multiplexing applications is the ability to readily combine high density signal carrying capability with high current carrying capacity all in the same compact package. This paper describes an approach to building ultra-thin multilayer circuits in a repeatable high volume production process. Properties evaluated include dielectric strength between layers, current carrying capacity, and ability to withstand tight folds in flex-to-install applications. Also included is data on electrical performance after high temperature and humidity exposure, and a discussion of minimum pad and via size limitations.