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Technical Paper

Development Status of the Mini Pressurized Logistics Module Environmental Control and Life Support Subsystem and Equipment

1997-07-14
972556
The Mini Pressurized Logistics Module (MPLM) is being developed as the Italian contribution to the International Space Station (ISS) Programme. To improve the efficiency of European space programmes, the Italian Space Agency (ASI) and the European Space Agency (ESA) have decided to increase the commonality between the MPLM and the Columbus Orbital Facility (COF), the European laboratory contribution to the ISS. As a result ASI will provide to ESA a primary structure of the MPLM to be used as the primary structure for COF; in return ESA will provide to ASI the ECLS subsystem for the MPLM, which is a subset of the COF ECLS subsystem. This paper describes the functions of the MPLM ECLS subsystem, the analytical and developmental activities performed by the ECLS Contractor, Daimler-Benz Aerospace Dornier GmbH, and the development status of the various ECLS equipment.
Technical Paper

Development of Columbus Orbital Facility Thermal Mathematical Models for Integrated International Space Station Thermal Analyses

1996-07-01
961540
The Columbus Orbital Facility is being developed as the European laboratory contribution to the United States' led International Space Station programme. The need to exchange thermal mathematical models frequently amongst the Space Station partners for thermal analyses in support of their individual programme milestone, integration and verification activities requires the development of a commonly agreed and effective approach to identify and validate mathematical models and environments. The approach needs to take into account the fact that the partners have different model and software tool requirements and the fact that the models need to be properly tailored to include all the relevant design features. It must also decouple both programmes from the unavoidable design changes they are still undergoing. This problem presents itself for both active and passive thermal interfaces.
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