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Carbon fiber reinforced polymer (CFRP) composite material is an attractive structural material in applications where mass is critical. The carbon fiber matrix provides strength comparable to steel with only 25% of the density. The CFRP sheet can often also be made thinner than metal with similar mechanical properties, further increasing the mass savings. However, thermal challenges have arisen with the increased use of composites. In the area of electronics enclosures, traditional metal structures conduct and spread heat over large surfaces, but composites act as insulation. Heat generated by components causes internal temperatures to rise and has detrimental impact on the performance and reliability of the electronics. A method is proposed and tested that utilizes constant conductance heat pipes (CCHPs) that penetrate through the CFRP walls. The CCHPs are capable of transporting significant heat energy through a limited cross-section with a minimal temperature penalty.