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VGCF/Carbon composites have been shown to demonstrate high thermal conductivity, comparable to that of CVD diamond, implying utility in high performance electronic packaging. VGCF/carbon composites are unlike diamond in that, typical of most fiber reinforced composites, designed physical properties are incorporated into the composite through fiber architecture. Thermal performance for die cooling is frequently determined by the thermal impedance of the package, measured from the junction to ambient, ϕja, or jucntion to case, ϕjc. This paper reports the results of this test on VGCF/carbon composites with a 1D architecture.