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Forty billion dollars are lost each year due to the failure of various components in a vast array of electronic devices. These failures result in downtime for part replacement, product liability issues, and critical safety ramifications. Many of the failures are caused by corrosion due to the migration of moisture or solder flux through leak paths inherent in electronic connectors and other parts, typically at the interface between metal leads and plastic housings into which they are molded. All industry standard approaches to preventing these failures have severe limitations and drawbacks. The approaches include discarding parts that fail a leak test, employing elaborate hermetically sealed encasements, or applying surface sealants. Each method of solving the problem creates other problems: costly high scrap rates, heavy, bulky assemblies, or introduction of a foreign material through surface sealants.