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Defines the aviation industry standards for transfer of digital data between avionics system elements using multiple access, bi-directional protocol. Developed to provide an efficient data distribution system resulting in a reduction in the amount of airplane wiring and equipment interfaces.

In 1986 the airlines selected Ada as the high-order development language for avionics. ARINC 613 describes the Ada domain most suited for avionics software development. The standard provides valuable guidance to Ada compiler developers and Ada programmers.

This Report provides the reader with material to enhance the understanding of high frequency data link. This standard provides a snapshot of guidance material used in the development of ARINC 753, HF Data Link System, and ARINC 635, HF Data Link Protocols.

This standard contains necessary definitions and recommendations to implement the gatelink ground system and infrastructure, and provides general and specific guidelines for development and installation of gatelink systems and related communications infrastructure. Gatelink is defined as a high-speed, two-way communication link between a parked aircraft and a ground-based communications system.

This standard provides general and specific design guidance for the development and implementation of an OLAN for use in an aeronautical Open Systems Interconnection (OSI) communications environment. Only the physical layer and data link layer of the OSI Basic Reference Model (ISO 7498) are specified by this standard.

This standard describes electrical power system design and performance standards brought about by extensive use of digital avionics. This Report provides guidelines for designers of aircraft power system components and of power utilization components, both avionics and power converters such as motors and heaters.

This Specification provides standards for the effective control of the environment for avionic equipment, including basic design standards for avionics equipment and its installation to assure suitable thermal interfaces, design criteria, and cooling appraisal.