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Resistance Spot Welding is a manufacturing process widely used in several industrial segments, such as automotive, electronics, aerospace and others. It stands out from other welding processes, as it does not require addition material to join parts. This type of process needs to be robust and reliable in order to ensure the quality of the welded joint produced, as any variation in the quality of the weld point can affect the functionality and safety of the final product. The resistance spot welding process uses different technologies and operating sequences that depend on various characteristics, factors and parameters. The combinations and values of these allow for numerous possibilities, making their adjustments time-consuming, costly and exhaustive, so it is necessary to apply statistical techniques to optimize the process. In the literature, it is possible to find several statistical techniques for the optimization of the process.

The increasing use of embedded electronics in aerospace and automotive vehicles increases the designers' concern regarding the reliability of the components as well as the reliability of their interconnections. The discussion about the most appropriate method for assessing the reliability of solder joints for a given application is an ever-present theme in the literature. Several methods of prediction have been developed for assessing the reliability of solder joints. The standard method established by the industries for assessing reliability of solder joints is the thermal cycling. However, when the thermal distributions in real applications are studied, particularly in some electronic components used in on-board electronics of space systems, the thermal cycling does not represent what actually happens in practice in the packaging.