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This paper presents an Integrated Power Module (IPM) and an Integrated Power Unit (IPU) based on IGBT double-sided cooling technology. The IPU can be used as the motor controller in electric vehicle applications, and the IPM integrated in the IPU is packaged with the latest trench field-stop IGBT devices and is utilized with planar bonding as well as double-sided cooling technology. By adopting the planar bonding and double-sided cooling technology, module design has achieved elimination of the traditional wire bonds, even temperature distribution for the surface of dies, and improvement of thermal performance, which results in lower junction temperature rise. Through these factors, power cycling capability and long-time reliability of the module can be significantly improved. Test results show that compared with traditional single-sided direct liquid cooling module with a pin-fin structure, thermal resistance has been reduced by 23%.