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Modern military aircraft platforms are using more and more power which results in an ever increasing power density (SWaP). This in turn, generates more heat that has to be dissipated from the instrument panel and cockpit of the aircraft. Complicating this further is that the use of structural composites which are not efficient conductors of heat and the mission requirements of small heat signatures. Therefore alternative means of extracting the heat from the avionics systems must be used. Liquid cooled systems have the advantage over air cooled systems of a much higher heat transfer rate and the fact that the heat can be transported a significant distance from the source. Liquid cooled avionics have their own challenges as well. The architecture of the components (cold plates, etc.) used for extracting the heat from the electronics component must be optimized to perform consistently and reliably while maintaining the smallest footprint possible in the already crowded instrument panel.