Technical Paper
Tackling the Thermal Design Challenges of Smaller, Lighter, and More Efficient Avionics Systems
2013-09-17
2013-01-2165
Electronic systems play a key role in the high reliability and safety of modern aircrafts. Components have become smaller and faster leading to an increase in power density and making thermal management a more vital part of the overall design. This paper will demonstrate how thermal transient testing combined with computational fluid dynamics (CFD) can help balance these design constraints and ensure that critical devices will work safely within their prescribed temperature limits. The first part of the paper will focus on the thermal characterization of a component using a continuous measurement method known as the static method per JEDEC51-1 standard. This data provides an insight of the overall component thermal performance and it can also be translated to structure function which helps with detecting potential internal thermal bottlenecks, such as a die attach material.
