Search Results

TeamIndus is the only Indian participant in the Google Lunar X Prize (GLXP). GLXP, also referred to as Moon 2.0, is an inducement prize space competition organized by the X Prize Foundation, and sponsored by Google. The mission objective is to soft land a rover on moon, travel 500 meters and transmit HD videos and images to Earth. Team Indus’s strategy is to design and realize a lunar lander that will deliver a rover on to the surface of the moon which will accomplish GLXP mission objectives. The mission configuration comprises of four phases- Earth orbits, moon orbits, descent and surface operations. The lander during its interplanetary journey from earth to moon is exposed to different thermal loads viz. solar load, earth IR and albedo, moon IR and albedo, cold space at 4K and eclipse periods. The lander is also exposed to high temperatures of thruster nozzle during orbital transfer maneuvers.

Bond wires are used in automotive electronic modules to carry current from external harness to components where flexibility under thermal cyclic loading is very essential between PCB (Printed Circuit Board) and connectors. They are very thin wires (few μm) made up of gold, aluminum or copper and have to undergo mechanical reliability to withstand extreme mechanical and thermal loads during different vehicle operation scenarios. Thermal reliability of bond wire is to make sure that it can withstand prescribed electric current under given boundary conditions without fusing thereby retaining electronic module's functionality. While carrying current, bond wire by virtue of its nature resists electric current flow and generates heat also called as joule heating. Joule heating is proportional to current flow and electrical resistance and if not handled properly can lead to thermal run away conditions.