Refine Your Search

Search Results

Technical Paper

A Matrix Array Technique for Evaluation of Adhesively Bonded Joints

2012-04-16
2012-01-0475
Adhesive bonding technology is playing an increasingly important role in automotive industry. Ultrasonic evaluation of adhesive joints of metal sheets is a challenging problem in Non-Destructive Testing due to the large acoustic impedance mismatch between metal and adhesive, variability in the thickness of metal and adhesive layers, as well as variability in joint geometry. In this paper, we present the results from a matrix array of small flat ultrasonic transducers for evaluation of adhesively bonded joints in both laboratory and production environments. The reverberating waveforms recorded by the array elements are processed to obtain an informative parameter, whose two-dimensional distribution can be presented as a C-scan. Energy of the reflected waveform, normalized with respect to the energy obtained from an area with no adhesive, is a robust parameter for discriminating "adhesive/no-adhesive" regions.
X