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In military aircraft, electronics are often subjected to operating environments well beyond their survival temperatures and with limited heat sinks. The current approach is to use a Liquid Cooling System (LCS) with either vehicle fuel or Polyalphaolephin (PAO) to cool electronics. However, advanced military platforms have found this approach limits their operational effectiveness. A thermal management system for electronics cooling in high temperature avionics environments is under development using Loop Heat Pipe (LHP) and heat pipe-based technology. The system reduces thermal energy transport inefficiencies within electronics enclosures, identifies potential sinks to provide continuous heat rejection over the operating envelope of the platform, and provides passive thermal energy transport from the electronics enclosure to selected sinks. The system developed to accomplish these tasks is divided into two subsystems.