Technical Paper
A Research on Coupled Transient Analysis of Thermal Flow and Thermal Stress
2005-04-11
2005-01-0516
In SAE paper 2004-01-1345, author focused on how to use a steady state temperature result obtained by a CFD analysis to conduct a thermal-stress analysis easily with 3 data transfer methods (Direct Conversion Method, Surface Mapping Method and Volume Mapping Method). The advantage and disadvantage of the 3 methods were compared in that paper and a steady state analysis of an engine exhaust manifold was used to show the accuracy, flexibility, efficiency and practicality. In this paper, how to simplify data transfer in a transient coupling is introduced. In transient couplings, 3 troublesome operations always happen. They are 1) multisteps coupling, 2) change of element from low to high order, and 3) estimation of mid node temperature loads of high order elements. In this paper, CFD (Computational Fluid Dynamics) software adopted is SC/Tetra [1], which generates hybrid mesh consisting of tetrahedron, hexahedron, and prism as well as pyramid elements.