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The propulsion system in most Electric Drive Vehicles (EDVs) requires an internal combustion engine in combination with an alternating current (AC) electric motor. An electronic device called a power inverter converts battery DC voltage into AC power for the motor. The inverter must be decoupled from the DC source, so a large DC-link capacitor is placed between the battery and the inverter. The DC-link capacitors in these inverters negatively affect the inverters size, weight and assembly cost. To reduce the design/cost impact of the DC-link capacitors, low loss, high dielectric constant (κ) ferroelectric materials are being developed. Ceramic ferroelectrics, such as (Pb,La)(Zr,Ti)O3 [PLZT], offer high dielectric constants and high breakdown strength. Argonne National Laboratory and Delphi Electronics & Safety have been developing thin-film capacitors utilizing PLZT.

High power electronic applications in the automotive industry require interconnecting substrates that have high reliability, high thermal conductivity, high current capability, multi-layer potential, and small size. This paper addresses the design requirements for automotive power substrates and how ever increasing demands are challenging the current substrate technology. Four different substrate material types, with various design features, capable of meeting these stringent requirements are described. Thermal impedance testing of each substrate along with design variations to enhance thermal capability was completed. The results of the thermal testing are compared based on appropriate application of the substrate technology.

The requirements for harsh environment (e.g. on-engine, on-or in-transmission) electronic controllers in automotive applications have been steadily becoming more and more stringent. Along with the environmental concerns come the challenges of meeting overall size constraints required of increasingly complex controllers by utilizing finer features and geometries. Electronic substrate technologists have been responding to this challenge effectively in an effort to meet the performance, size and cost requirements. This paper deals with two primary interconnection substrate technologies that are poised to meet the challenge: 1) organic laminate based high performance printed wiring boards and 2) ceramic based substrates.